AzureWave AW-NH611 802.11bgn + BT SiP Module
- Form Factor: SiP Module
- Chipset: Broadcom BCM4329
- Wireless Standard: 802.11bgn + BT
- Frequency: 2.4 GHz
- Integrates Broadcom solutions of BCM4329 Wi-Fi/BT/FM SoC
- SDIO/SPI interfaces support for WLAN
- ECI-enhanced coexistence support. Ability to coordinate BT SCO transmissions around WLAN receives
- High speed UART and PCM for Bluetooth and FM I2S interface for FM
- FM subsystem control through Bluetooth HCI interface
- Flexible power supply (2.3V~5.5V)
- Multiple power saving modes for low power consumption
- Lead-free, halogen-free design
- Small footprint package, low power consumption, improved security
- Cisco compatible extension (CCX)certified
Compliant with the IEEE 802.11b/g/n standard, the AW-NH611 uses DSSS, OFDM, DBPSK, DQPSK, CCK, and QAM baseband modulation technologies with minimal system power requirements, in addition to the support of WPA/WPA2 (personal) and WEP encryption. Also supports the IEEE 802.11i security standard through AES and TKIP acceleration hardware for faster data encryption. For the video, voice, and multimedia applications the AW-NH611 supports 802.11e Quality of Service (QoS).
Bluetooth 2.1+Enhanced Data Rate (EDR) compliant. Aupports extended Synchronous Connections (eSCO) for enhanced voice quality by allowing for retransmission of dropped packets and Adaptive Frequency Hopping (AFH) for reducing radio interference.
For FM receiver/transmitter, the AW-NH611 supports 76 MHz to 108 MHz FM bands, and supports the European Radio Data Systems (RDS) and the North American Radio Broadcast Data System (RBDS) modulations.
Supports standard interface SDIO v1.2 (4-bit and 1-bit) for WLAN, High-speed UART interface for BT/FM host controller interface, and PCM for BT/FM audio data. The demodulated FM audio signal is available as line-level analog stereo output. AW-NH611 is suitable for multiple mobile processors for different applications. With the combo functions and the good performance it is the best solution for consumer electronics.
|Dimensions||9.6 mm × 9.6 mm × 1.2 mm|
|Form Factor||SiP Module|
|Chipset MFG||Broadcom / Cypress|
|Wireless Standard||802.11bgn + BT|
|Temperature||-20°C to 70°C|
|Host Interface||SDIO (Wi-Fi) + SPI (BT)|
|Interface Connector||SDIO (Wi-Fi) + SPI (BT)|