We use cookies to make your experience better. To comply with the new e-Privacy directive, we need to ask for your consent to set the cookies. Learn more.
SparkLAN AP6275SDPR SiP Module | M.2 1216 with PCIe and UART/PCB | Dual-Band 802.11ax Wi-Fi 6 | 2×2 I-PEX MHF4
$29.00
Model
AP6275SDPR
💻 Complete solution with 11ax Wi-Fi 6.
Specifically developed for tablets, OTT boxes, portable devices, thin client devices, gaming machines, and more.
Specifically developed for tablets, OTT boxes, portable devices, thin client devices, gaming machines, and more.
Volume Pricing:
Get a Quote
🙌 SiP IN THE POWER OF Wi-Fi 6. The beloved Broadcom SoC is now packed in the most popular M.2 1216 form factor with external antenna connectors, meaning little design work for the team, faster time to market, and equal performance and perfection.
🏁 MULTIPLE INTERFACES. High-speed PCIe and SDIO versions. Great performance while maintaining power efficiency.
🏭 UNIVERSAL DESIGN. Supports the popular M.2 1216 form factor and external antenna. Reduce design time by up to 40% and be ready for production in no time.
📈 CERTIFICATIONS AVAILABLE. Getting pre-certified means quality and helps to reduce the cost to market.
AP6275SDPR is an 802.11ax (Wi-Fi 6) SiP module designed for implementation with as little effort as possible. The module is packaged in an M.2 LGA Type 1216 form factor, with 2× MFH4 external antenna ports to output the signal. No work is required on antenna matching, leveraging the product's certifications. By adopting Wi-Fi 6 technology, the unit can be powered with increased capacity, faster speed, better coverage connections, improved battery life of IoT sensors, and an extended range of Wi-Fi signals.
AP6275SDPR supports advanced encryption for enhanced security. It runs Wi-Fi through PCIe v3.0 and has UART/PCM. Powered by a Broadcom chipset design, AP6275SDPR supports Linux and Android, making it a perfect solution for powerful but cost-effective Wi-Fi 6 client-oriented applications.
| Model Number | AP6275SDPR |
|---|---|
| Brand | SparkLAN |
| Dimensions | 12 mm × 16 mm × 1.8 mm |
| Temperature | Operating: –10 °C to 65 °C (14 °F to 149 °F)Storing: –40 °C to 125 °C (–40 °F to 257 °F) |
| WLAN Form Factor | M.2 (LGA 1216), SiP Module |
| Chipset Maker | Broadcom |
| Chipset Model | BCM43752 |
| Chipset | Broadcom BCM43752 |
| Wireless Standard | 802.11ax (Wi-Fi 6) |
| Frequency | Dual-band |
| MIMO | 2×2 |
| Antenna/Connector | I-PEX MHF4 |
| Host Interface | PCIe (Wi-Fi) and UART/PCM |
| Interface Connector | WLAN: mPCIe v3.0 |
| RF Output Summary | 19.5 dBm |
| Operating System Support | Windows, Linux, Android |
| Certifications | REACH, ROHS |
| Warranty | 1 Year |
Write Your Own Review
We found other products you might like!
