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SparkLAN 802.11b/g/n Wi-Fi + Bluetooth 4.1 M.2 LGA Type 1216 Module (Wi-Fi 4) | 1T1R
AP6212SD is a 11b/g/n 1T1R Wi-Fi + Bluetooth 4.1 Wi-Fi module. It's a highly integrated single-chip solution and provides the highest level of integration for a mobile or handheld wireless system. It offers the lowest cost in the industry for smartphones, tablets, and a wide range of other portable devices. The Wi-Fi module is designed to address the needs of highly mobile devices that require minimal power consumption and compact size. It implements the world's most advanced Enhanced Collaborative Coexistence algorithms and hardware mechanisms, allowing for an extremely collaborative WLAN and Bluetooth coexistence.
It can achieve up to a speed of 72.2 Mbps with single stream in 802.11n draft, 54 Mbps as specified in IEEE 802.11g, or 11 Mbps for IEEE 802.11b to connect to the wireless LAN. The integrated module provides SDIO interface for Wi-Fi, UART/I2S/PCM interface for Bluetooth.
This compact module is a total solution for a combination of Wi-Fi and Bluetooth technologies. The module is specifically developed for smartphones and portable devices.
Model Number | AP6212SD |
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Brand | SparkLAN |
Dimensions | 12 mm × 16 mm × 1.52 mm |
Temperature | Operating: –10 °C to 65 °C (14 °F to 149 °F) Storing: –40 °C to 85 °C (–40 °F to 185 °F) |
WLAN Form Factor | SiP Module |
Chipset Maker | Broadcom |
Chipset Model | BCM43438 |
Chipset | Broadcom BCM43438 |
Wireless Standard | 802.11bgn + BT |
Frequency | 2.4 GHz |
MIMO | 1×1 |
Antenna/Connector | I-PEX MHF4 |
Application | Wi-Fi + BT Combo |
Host Interface | SDIO (Wi-Fi) and UART/PCM (BT) |
Interface Connector | WLAN: SDIO v2.0 Bluetooth 4.1: UART/PCM |
RF Output Summary | 9 dBm |
Operating System Support | Linux, Android |
Certifications | FCC, IC, CE, NCC, RCM/A-Tick/C-Tick, REACH, ROHS, TELEC |