Compex WSD377 802.11ac/abgn + Bluetooth SiP Module | Qualcomm QCA9377-3

$19.50
Model
WSD377
2.4/5 GHz Wi-Fi + Bluetooth LGA module designed for WLAN/BT and low-energy communications
Volume Pricing: Get a Quote
  • Form Factor: SiP Module
  • Chipset: Qualcomm QCA9377-7
  • Wireless Standard: 802.11ac/abgn + BT
  • Frequency: 2.4/5GHz, Dualband
  • Antenna: 1x1 MIMO (1Tx1R)

Features
  • Chipset: Qualcomm Atheros QCA9377-3
  • 802.11ac Wave 2 dual-band LGA module
  • Dimension: 12mm x 12mm x 1.5mm
  • Interface: Low-power SDIO 3.0
  • Bluetooth 4.2 + HS, BLE, and ANT+ and backward compatibility with BT 1.x and BT 2.x + Enhanced Data Rate
  • 3.3V DC power supply and I/O supply of 1.8V or 3.3V
More Information
Model Number WSD377
Brand Compex
Dimensions 12 mm × 12 mm × 1.5 mm
Temperature –20 °C to 70 °C
WLAN Form Factor SiP Module
Chipset Maker Qualcomm
Chipset Model QCA9377-7
Chipset Qualcomm QCA9377-3
Wireless Standard 802.11ac/abgn + BT
Frequency Dual-band
MIMO 1×1
Antenna/Connector Pad Interface
Host Interface SDIO
Interface Connector LGA
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