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Compex WSD377 802.11ac/abgn + Bluetooth SiP Module | Qualcomm QCA9377-3
$19.50
Model
WSD377
2.4/5 GHz Wi-Fi + Bluetooth LGA module designed for WLAN/BT and low-energy communications
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- Form Factor: SiP Module
- Chipset: Qualcomm QCA9377-7
- Wireless Standard: 802.11ac/abgn + BT
- Frequency: 2.4/5GHz, Dualband
- Antenna: 1x1 MIMO (1Tx1R)
- Chipset: Qualcomm Atheros QCA9377-3
- 802.11ac Wave 2 dual-band LGA module
- Dimension: 12mm x 12mm x 1.5mm
- Interface: Low-power SDIO 3.0
- Bluetooth 4.2 + HS, BLE, and ANT+ and backward compatibility with BT 1.x and BT 2.x + Enhanced Data Rate
- 3.3V DC power supply and I/O supply of 1.8V or 3.3V
Model Number | WSD377 |
---|---|
Brand | Compex |
Dimensions | 12 mm × 12 mm × 1.5 mm |
Temperature | –20 °C to 70 °C |
WLAN Form Factor | SiP Module |
Chipset Maker | Qualcomm |
Chipset Model | QCA9377-7 |
Chipset | Qualcomm QCA9377-3 |
Wireless Standard | 802.11ac/abgn + BT |
Frequency | Dual-band |
MIMO | 1×1 |
Antenna/Connector | Pad Interface |
Host Interface | SDIO |
Interface Connector | LGA |
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