USI WM-BAC-BM-25 802.11ac/abgn + Bluetooth SiP Module | Broadcom BCM43455

$12.50
Model
WM-BAC-BM-25
Broadcom/Cypress 802.11ac/abgn Wi-Fi + BT 4.2 LGA SiP module | Integrated chip antenna
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  • Form Factor: SiP Module
  • Chipset: Broadcom BCM43455
  • Wireless Standard: 802.11ac/abgn + BT
  • Frequency: 2.4 GHz/5 GHz, Dualband
  • Antenna: 1×1 MIMO (1T×1R)

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Features

  • Broadcom/Cypress BCM43455 SiP Module
  • Dual Band Wi-Fi 802.11ac/abgn + Bluetooth BLE 4.2 Smart Ready
  • I/O: SDIO 3.0 (Wi-Fi) + UART (Bluetooth)
  • Form Factor: 65 pin LGA (15 mm × 10 mm × 1.8 mm)
  • Integrated Dual Band Chip Antenna

More Information
Model Number WM-BAC-BM-25
Brand USI
Dimensions 8.8 mm × 7.2 mm × 1.2 mm
Temperature −10 °C to 65 °C
WLAN Form Factor SiP Module
Chipset Maker Broadcom
Chipset Model BCM43455
Chipset Broadcom BCM43455
Wireless Standard 802.11ac/abgn + BT
Frequency Dual-band
MIMO 1×1
Antenna/Connector Integrated Antenna
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