VIA Technologies COMEDB3 SBC
VIA Embedded COMEDB3
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- Form Factor: SBC
- Product Series: VIA COM-Express
- Cooling: w/o Fan
Targeted at industrial PC and large OEM customers focused on dynamic application segments where compactness is of the utmost importance, including medical, advanced gaming, test and measurement, industrial (machine vision system) and military applications. Customers can take advantage of a proprietary start-up kit including a multi-I/O baseboard reference, or can utilize VIA's extensive technical support in developing a custom baseboard for a short time to market approach.
Measuring 84mm x 55mm, the Mini COM Express is an industry standard embedded form factor developed by the PICMG (PCI Industrial Computer Manufacturers Group) to match the feature and performance requirements of embedded segments where ultra compact solutions are required. The COM Express specification integrates core CPU, chipset and memory on the module, providing support for extensive connectivity options, including USB, audio, video, and Ethernet, through board-to-board connectors to an I/O baseboard.
|Dimensions||125 x 95 x 2mm|
|Product Series||VIA COM-Express|
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