The VIA AMOS-5001 modular chassis kit is an ultra compact solution designed to take full advantage of boards based on the VIA-developed Em-ITX form factor, making it easy to create a broad spectrum of easy to assemble fanless system designs for a wide variety of embedded applications.
The VIA AMOS-5001 chassis kit leverages the unique features that the Em-ITX for factor brings to the embedded market, including a rich I/O feature set along both sides of the board through unique dual I/O coastlines, and the EMIO bus, which uses both legacy and modern bus technologies to work with a growing range of Em-ITX expansion modules in a variety of application specific I/O configurations.
Systems built using the VIA AMOS-5001 chassis kit are completely fanless and can withstand a wide temperature range of -20°C to 55°C. Capable of sustaining a g-force of up to 50, VIA AMOS-5001 chassis kits are easily assembled and maintained, using only four mechanical pieces to form a robust, fanless system with extensive I/O options.
The VIA AMOS-5001 can be paired with VIA EITX-3001 Series boards and is ideal for a wide range of embedded segments including medical, healthcare, industrial and building automation, digital signage, kiosk, POI/POS, gaming and surveilLANce applications.